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Jetson AGX Orin 开发套件
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Jetson AGX Orin 64GB
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Jetson AGX Orin Industrial
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Jetson AGX Orin 32GB
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AI
效能
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275 TOPS
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248 TOPS
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200 TOPS
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GPU
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2048-core NVIDIA Ampere architecture GPU with 64 Tensor
Cores |
1792-core NVIDIA Ampere architecture GPU with 56 Tensor Cores |
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GPU 最高频率
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1.3 GHz |
1.2GHz |
930MHz |
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CPU
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12-core Arm® Cortex®-A78AE v8.2 64-bit CPU
3MB L2 + 6MB L3
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8-core Arm® Cortex®-A78AE v8.2 64-bit CPU 2MB L2 + 4MB L3 |
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CPU 最高频率
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2.2 GHz |
2.0 GHz |
2.2 GHz |
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DL 加速器
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2x NVDLA v2 |
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DLA 最高频率
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1.6GHz |
1.4GHz |
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视觉加速器
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1x PVA v2 |
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安全丛集引擎
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- |
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内存
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64GB 256-bit LPDDR5
204.8GB/s
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64GB 256-bit LPDDR5 (+ ECC)
204.8GB/s
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32GB 256-bit LPDDR5
204.8GB/s
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储存空间
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64GB eMMC 5.1 |
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影片编码
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2x 4K60 (H.265)
4x 4K30 (H.265)
8x 1080p60 (H.265)
16x 1080p30 (H.265)
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1x 4K60 (H.265)
3x 4K30 (H.265)
7x 1080p60 (H.265)
15x 1080p30 (H.265)
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1x 8K30 (H.265)
2x 4K60 (H.265)
4x 4K30 (H.265)
9x 1080p60 (H.265)
18x 1080p30 (H.265)
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影片解码
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1x 8K30 (H.265)
3x 4K60 (H.265)
7x 4K30 (H.265)
11x 1080p60 (H.265)
22x 1080p30 (H.265)
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1x 8K30 (H.265)
3x 4K60 (H.265)
7x 4K30 (H.265)
11x 1080p60 (H.265)
23x 1080p30 (H.265)
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1x 8K30 (H.265)
2x 4K60 (H.265)
4x 4K30 (H.265)
9x 1080p60 (H.265)
18x 1080p30 (H.265)
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CSI 摄影机
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16-lane MIPI CSI-2 connector
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Up to 6 cameras (16 via virtual channels)
16 lanes MIPI CSI-2
D-PHY 2.1 (up to 40Gbps) | C-PHY 2.0 (up to 164Gbps)
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PCIe*
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x16 PCIe slot supporting x8 PCIe Gen4
M.2 Key M slot with x4 PCIe Gen4
M.2 Key E slot with x1 PCIe Gen4
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Up to 2 x8 + 1 x4 + 2 x1
(PCIe Gen4, Root Port, & Endpoint)
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USB*
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USB Type-C connector: 2x USB 3.2 Gen2
USB Type-A connector: 2x USB 3.2 Gen2, 2x USB 3.2 Gen1
USB Micro-B connector: USB 2.0
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3x USB 3.2 Gen2 (10 Gbps)
4x USB 2.0
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网络*
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RJ45 connector with up to 10 GbE |
1x GbE
1x 10GbE
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显示器
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1x DisplayPort 1.4a (+MST) connector |
1x 8K60 multi-mode DP 1.4a (+MST)/eDP 1.4a/HDMI 2.1
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其他 I/O
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40-pin header (UART, SPI, I2S, I2C, CAN, PWM, DMIC, GPIO)
12-pin automation header
10-pin audio panel header
10-pin JTAG header
4-pin fan header
2-pin RTC batter backup connector
microSD slot
DC power jack
Power, Force Recovery, and Reset buttons
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4x UART, 3x SPI, 4x I2S, 8x I2C, 2x CAN, PWM, DMIC &
DSPK,
GPIOs
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功耗
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15W - 60W |
15W - 75W |
15W - 40W |
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机械部分
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110mm x 110mm x 71.65mm
(Height includes feet, carrier board, module, and thermal solution)
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100mm x 87mm
699-pin Molex Mirror Mezz Connector
Integrated Thermal Transfer Plate
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